Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process

Tin whiskering is a concern with tin-rich alloy finishes on electronic part terminations. Solder dipping may be used to replace the original finish with eutectic tin-lead solder for tin-whiskering risk mitigation purposes. However, the solder dipping process may expose electronic parts to thermomechanical damage within the package due to the thermal… CONTINUE READING