Assessing the Reliability of High Temperature Solder Alternatives

Abstract

Alternatives to solder suitable for operating temperatures above 175°C or so include sintered Ag as well as fused nano-particles of Ag or Cu, and micron-scale Cu particles fused with and bonded together by Ag nano-particles. The nature of these is very different from that of common solder materials, but assessments of their long term reliability too often… (More)

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