Arsenic-Doped High-Resistivity-Silicon Epitaxial Layers for Integrating Low-Capacitance Diodes

@inproceedings{Sakic2011ArsenicDopedHE,
  title={Arsenic-Doped High-Resistivity-Silicon Epitaxial Layers for Integrating Low-Capacitance Diodes},
  author={Agata Sakic and Tom L. M. Scholtes and W. D. A. M. de Boer and Negin Golshani and Jaber Derakhshandeh and Lis K. Nanver},
  booktitle={Materials},
  year={2011}
}
An arsenic doping technique for depositing up to 40-μm-thick high-resistivity layers is presented for fabricating diodes with low RC constants that can be integrated in closely-packed configurations. The doping of the as-grown epi-layers is controlled down to 5 × 1011 cm-3, a value that is solely limited by the cleanness of the epitaxial reactor chamber. To ensure such a low doping concentration, first an As-doped Si seed layer is grown with a concentration of 1016 to 1017 cm-3, after which the… CONTINUE READING

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