Area-elficient interlayer signal propagation in 3D IC by introducing electron spin

@article{Debroy2017AreaelficientIS,
  title={Area-elficient interlayer signal propagation in 3D IC by introducing electron spin},
  author={Sanghamitra Debroy and Amit Acharyya and Shiv Govind Singh and Swati Ghosh Acharyya},
  journal={2017 European Conference on Circuit Theory and Design (ECCTD)},
  year={2017},
  pages={1-4}
}
Through Silicon Via (TSV) is the major technology in order to transmit data among various devices in 3D IC. Therefore higher concentration of TSV is required for higher packing density in 3D IC. In order to obtain high density of TSV, the dimensions of TSV needs to be reduced. This may be achieved by increasing the surface area per layer which will benefit in packing of more components for any operation including logic implementation. In this paper we introduce electron spin rather than charge… CONTINUE READING