Area-I/O RDL routing for chip-package codesign considering regional assignment

@article{Lin2010AreaIORR,
  title={Area-I/O RDL routing for chip-package codesign considering regional assignment},
  author={Kun-Sheng Lin and Hsin-Wu Hsu and Ren-Jie Lee and Hung-Ming Chen},
  journal={2010 IEEE Electrical Design of Advanced Package & Systems Symposium},
  year={2010},
  pages={1-4}
}
Flip-Chip package provides high density I/Os and better performance in package size, signal/power integrety, and wirelength. Routing on its Re-Distribution Layer (RDL) is one of the most difficult stage in Flip-Chip packaging due to the increasing number of I/Os in modern VLSI designs. Area I/O can shorten the signal path and further increases the I/O density, but the design complexity is also higher. The Area I/O RDL routing problem is introduced in this paper, considering wirelength… CONTINUE READING

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