Application of three-parameter lognormal distribution in EM data analysis

  title={Application of three-parameter lognormal distribution in EM data analysis},
  author={Baozhen Li and Emmanuel Yashchin and Cathryn Christiansen and Jason Gill and Ronald Filippi and Timothy D. Sullivan},
  journal={Microelectronics Reliability},
Three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections. 

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Line depletion EM characteristics of Cu interconnects

  • B. Li
  • IEEE Trans. On Devices & Materials Reliability,
  • 2004
1 Excerpt

Effects of liner thickness on electromigration lifetime,

  • E. G. Liniger
  • J. Appl. Phys.,
  • 2003
1 Excerpt

Investigation of Via-Dominated Multi-Modal EM Failure Distributions in Dual Damascene Cu Interconnects with a Discussion of the Statistical Implications

  • J. Gill
  • Proc. 40 Annual Reliability Physics Symposium,
  • 2002
2 Excerpts

Paradoxical predictions and minimum failure time in electromigration

  • R. G. Filippi
  • Appl. Phys. Lett.,
  • 1995
1 Excerpt

Applied Life Data Analysis, pp544

  • W. Nelson
  • 1982
1 Excerpt

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