Application of self-assembled monolayer (SAM) in low temperature bump-less Cu-Cu bonding for advanced 3D IC

@article{Tan2010ApplicationOS,
  title={Application of self-assembled monolayer (SAM) in low temperature bump-less Cu-Cu bonding for advanced 3D IC},
  author={Chuan Seng Tan},
  journal={2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference},
  year={2010},
  pages={1-4}
}
  • Chuan Seng Tan
  • Published 2010 in
    2010 5th International Microsystems Packaging…
Self assembled monolayer (SAM) of alkane-thiol of 6-carbon (1-hexanethiol, C6) chain length is applied on Cu surface (deposited on Si substrate) and examined carefully. Firstly, the ability of SAM adsorption onto Cu surface is confirmed by the sharp rise of water contact angle (CA) on the surface. Next, the thermal stability of SAM when it is stored in… CONTINUE READING