Annealing process and structural considerations in controlling extrusion-type defects Cu TSV

@article{An2012AnnealingPA,
  title={Annealing process and structural considerations in controlling extrusion-type defects Cu TSV},
  author={Jinho An and Kwang-Jin Moon and Soyoung Lee and Do-Sun Lee and Kiyoung Yun and Byung-Lyul Park and Ho Jun Lee and Jiwoong Sue and Yeong-Lyeol Park and Gilheyun Choi and Ho-Kyu Kang and Chilhee Chung},
  journal={2012 IEEE International Interconnect Technology Conference},
  year={2012},
  pages={1-3}
}
Stresses induced by the large volume of Cu in Through Silicon Vias (TSV) can result in global/local Cu extrusion which may affect reliability in 3D chip stacking technologies beyond the 28 nm node for high performance mobile devices. In this work, TSV structural factors that can influence extrusion post via filling are studied. In addition, the impact of… CONTINUE READING