Analytical heat transfer model for thermal through-silicon vias

  title={Analytical heat transfer model for thermal through-silicon vias},
  author={Hu Xu and Vasilis F. Pavlidis and Giovanni De Micheli},
  journal={2011 Design, Automation & Test in Europe},
Thermal issues are one of the primary challenges in 3-D integrated circuits. Thermal through-silicon vias (TTSVs) are considered an effective means to reduce the temperature of 3-D ICs. The effect of the physical and technological parameters of TTSVs on the heat transfer process within 3-D ICs is investigated. Two resistive networks are utilized to model the physical behavior of TTSVs. Based on these models, closed-form expressions are provided describing the flow of heat through TTSVs within a… CONTINUE READING
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COMSOL Multiphysics 4.0

  • COMSOL Inc.
  • 2010. [Online]. Available:
  • 2010
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