Analysis of new lead-free solder alloy microstructure

Abstract

Combining with the analysis of solder melting point, spreading rate and tensile strength, a new Sn-Zn lead-free solder system has been developed. The solder melting point is 183 °, it is very close to Pb-Sn eutectic solder melting temperature, the corresponding melting range of this solder is smaller, and it has higher bonding force and other advantages… (More)

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