Analysis of multi-layered microelectronic packaging under uniformly distributed loading

  title={Analysis of multi-layered microelectronic packaging under uniformly distributed loading},
  author={Yujun Wen and Cemal Basaran},
An accurate estimate of interfacial stresses in multi-layered microelectronic packaging is very important for design and prediction of delamination-related failures. An analytical model for stress analysis of multi-layered stacks, which is based on an extension of Valisetty s model (Bending of Beams, Plates and Laminates: Refined Theories and Comparative Studies, Ph.D. thesis, Georgia Institute of Technology, Atlanta, March 1983), is proposed in this paper. This analytical approach considers… CONTINUE READING
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