Analysis of interactions among barriers of eco-efficiency in electronics packaging industry

@inproceedings{Ravi2015AnalysisOI,
  title={Analysis of interactions among barriers of eco-efficiency in electronics packaging industry},
  author={Velayudham Ravi},
  year={2015}
}
Abstract Electronics packaging type and its size have an effect on product wastes in stamping, molding and plating operations. Waste streams from these operations like copper, polymerized thermoset plastic, caustic and acidic effluents have non-recyclable hazardous content that are detrimental to cause of environment. Eco-efficiency that stands for reducing the environmental impact added, while increasing value of output produced, assumes great importance in this context. There are a number of… CONTINUE READING