Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives

@article{Heuck2011AnalysisAM,
  title={Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives},
  author={Nicolas Heuck and A. Langer and A. Stranz and Glen Palm and Robert Sittig and Andrey Bakin and A. Waag},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2011},
  volume={1},
  pages={1846-1855}
}
The pressure-assisted sintering of a sub-micrometer silver paste-sometimes called “silver-sintering” or “low temperature joining technique (LTJT)”-is already used in many power electronics industry applications and provides die-attach layers with excellent mechanical, electrical, and thermal properties. The present challenge is to fit both the coefficient of thermal expansion (CTE) and the mechanical properties of the die-attach layer to the characteristics of chip and substrate to reduce the… CONTINUE READING

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References

Publications referenced by this paper.
Showing 1-10 of 29 references

Die niedertemperatur-verbindungstechnik der leistungselektronik

  • C. Mertens
  • Ph.D. thesis, Inst. Elektrophys., Braunschweig…
  • 2002
Highly Influential
8 Excerpts

Metallurgy for SiC die attach for operation at 500 °C

  • R. W. Johnson, P. Zheng, P. Henson, L. Chen
  • Proc. High Temp. Electron. Conf., 2010, pp. 8–17.
  • 2010
1 Excerpt

SiC-die-attachment for high temperature applications

  • N. Heuck, G. Palm, T. Sauerberg, A. Stranz, A. Waag, A. Bakin
  • Mater. Sci. Forum, vols. 645–648, pp. 741–744…
  • 2010
1 Excerpt

Swelling phenomena in sintered silver die attach structures at high temperatures : Reliability problems and solutions for an operation above 350 ° C , ” in

  • S. Muller Heuck, G. Palm, A. Bakin, A. Waag
  • Proc . Int . High Temp . Electron . Conf .
  • 2010

Swelling phenomena in sintered silver die attach structures at high temperatures: Reliability problems and solutions for an operation above 350 °C

  • N. Heuck, S. Muller, G. Palm, A. Bakin, A. Waag
  • Proc. Int. High Temp. Electron. Conf…
  • 2010
2 Excerpts

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

  • D.-J. Yu, X. Chen, G. Chen, G.-Q. Lu, Z.-Q. Wang
  • Mater. Design, vol. 30, no. 10, pp. 4574–4579…
  • 2009

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