An integrated passive balun on Si, SiGe, and GaAs substrates

Abstract

This paper reports the design of a low loss, small size, and low cost dual balun for quad band GSM application. The balun was initially designed on a GaAs substrate for wirebond applications [1], and further design optimizations were conducted on a typical SiGe substrate and on high resistivity Si substrates to implement the balun fabrication in a… (More)

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Cite this paper

@article{Li2008AnIP, title={An integrated passive balun on Si, SiGe, and GaAs substrates}, author={Li Li and Darioush Keyvani and Jangsup Yoon and Vineer Bhan}, journal={2008 58th Electronic Components and Technology Conference}, year={2008}, pages={694-700} }