An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies

@article{Varghese2007AnEA,
  title={An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies},
  author={Joe Varghese and Abhijit Dasgupta},
  journal={Microelectronics Reliability},
  year={2007},
  volume={47},
  pages={1095-1102}
}
This paper presents an experimental approach to identify the fatigue failure envelopes for solder damage in Printed Wiring Assemblies (PWAs) subjected to dynamic loading. An empirical, rate-dependent, power-law durability model, motivated by mechanistic considerations, is proposed to characterize the failure envelopes in terms of PWA flexural strain and strain rate, as damage metrics. It is further shown that there are critical combinations of these damage parameters, beyond which the failure… CONTINUE READING
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