An evaluation of the antibacterial properties and shear bond strength of copper nanoparticles as a nanofiller in orthodontic adhesive.


OBJECTIVES To evaluate the antibacterial properties and effects of an orthodontic adhesive containing copper nanoparticles (NPs) on the material's shear bond strength. METHODS Antimicrobial activity was analysed by a disk diffusion test against S. aureus, E. coli and S. mutans. The NPs were added to the orthodontic adhesive at 0.0100 wt%, 0.0075 wt%, and… (More)