An embedded device technology based on a molded reconfigured wafer

  title={An embedded device technology based on a molded reconfigured wafer},
  author={Markus Brunnbauer and E. Furgut and Gottfried Beer and Travis J. Meyer and Harry Hedler and J. Belonio and Etsuji Nomura and Kenji Kiuchi and Keizo Kobayashi},
  journal={56th Electronic Components and Technology Conference 2006},
  pages={5 pp.-}
We report an innovative embedded device wafer level packaging technology based on a "molded reconfigured 200 mm wafer". Silicon dice are tested, grinded, and diced. For the set-up of the "reconfigured wafer" these bare silicon dice are placed faces down onto a carrier system. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression molding is a promising approach with respect to robust processing, topology, adhesion, and reliability properties… CONTINUE READING
Highly Cited
This paper has 100 citations. REVIEW CITATIONS
73 Citations
3 References
Similar Papers


Publications citing this paper.
Showing 1-10 of 73 extracted citations

100 Citations

Citations per Year
Semantic Scholar estimates that this publication has 100 citations based on the available data.

See our FAQ for additional information.


Publications referenced by this paper.
Showing 1-3 of 3 references

Trend of WLP Technology and Next Generation Packaging “WLP and EWLP

  • D. Komatsu, T. Wakabayashi
  • 5th International Workshop on Microelectronics…
  • 2005

Bumpless Built-Up Layer Packaging

  • S. N. Towle
  • ASME International Mechanical Engineering…
  • 2001

Similar Papers

Loading similar papers…