An embedded device technology based on a molded reconfigured wafer

@article{Brunnbauer2006AnED,
  title={An embedded device technology based on a molded reconfigured wafer},
  author={Markus Brunnbauer and E. Furgut and Gottfried Beer and Travis J. Meyer and Harry Hedler and J. Belonio and Etsuji Nomura and Kenji Kiuchi and Keizo Kobayashi},
  journal={56th Electronic Components and Technology Conference 2006},
  year={2006},
  pages={5 pp.-}
}
We report an innovative embedded device wafer level packaging technology based on a "molded reconfigured 200 mm wafer". Silicon dice are tested, grinded, and diced. For the set-up of the "reconfigured wafer" these bare silicon dice are placed faces down onto a carrier system. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression molding is a promising approach with respect to robust processing, topology, adhesion, and reliability properties… CONTINUE READING
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