An advanced study for defect disposition through 193 nm aerial imaging

@inproceedings{Duerr2006AnAS,
  title={An advanced study for defect disposition through 193 nm aerial imaging},
  author={Arndt C. Duerr and Axel M. Zibold and Klaus B{\"o}hm and Carl Zeiss and Carl-Zeiss Promenade},
  year={2006}
}
  • Arndt C. Duerr, Axel M. Zibold, +2 authors Carl-Zeiss Promenade
  • Published 2006
With decreasing structure sizes on masks also the acceptable CD variation corridor for printing on the wafer and therefore, the maximum allowed defect size is decreasing. This has not only implications to the accuracy and repeatability of front-end processes such as writers, etchers, etc. but also challenges defect inspection and qualification. Defect qualification is usually done by an AIMS tool which optically simulates the aerial image of the structures by applying the same illumination… CONTINUE READING

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