An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper


An ultra-thin (20 μm), flexible CMOS stress sensor for hybrid systems-in-foil (HySiF) is presented. The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the extraction of object shape and operation status. In-plane stress is linearly converted to electrical signals… (More)
DOI: 10.1109/JSSC.2015.2498183


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