An Implementation of Performance-Driven Block and I/O Placement for Chip-Package Codesign

@inproceedings{Lai2008AnIO,
  title={An Implementation of Performance-Driven Block and I/O Placement for Chip-Package Codesign},
  author={Ming-Fang Lai and Hung-Ming Chen},
  booktitle={ISQED 2008},
  year={2008}
}
As silicon technology scales, we can integrate more and more circuits on a single chip, which means more I/Os are needed in modern designs. The flip-chip technology which was developed by IBM is better suited for I/O increase than the typical peripheral wire-bond design. One of the most important characteristics of flip-chip designs is that the I/O buffers could be placed anywhere inside a chip, just like core cells. Motivated by [14] in proposing various I/O planning constraints, we develop a… CONTINUE READING

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