An Automatic Bump Detecting System for LCD COG Module Using Fuzzy Reasoning

Abstract

The Chip-on-Glass (COG) package, which assemblies the driver IC onto a glass substrate with Anisotropic Conductive Film (ACF), is mainly used in the Liquid Crystal Display (LCD) module. With the higher demand of display capacity, the stability of COG interconnection under fine pitch package becomes more important and difficult. Interconnection test and bump… (More)

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