An Approach to Gate Assignment and Module Placement for Printed Wiring Boards

Abstract

High density packaging is one of the most urgent requirements in the design of digital systems. In the assembly of such systems, <underline>printed wiring boards</underline> (PWB's) are used very often to provide the necessary interconnection among circuit modules. Thus, methods to raise wiring density of PWB's are continually under investigation. Given a… (More)
DOI: 10.1109/TC.1980.1675649

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Cite this paper

@article{Nishioka1978AnAT, title={An Approach to Gate Assignment and Module Placement for Printed Wiring Boards}, author={Ikuo Nishioka and Takuji Kurimoto and Seiji Yamamoto and Isao Shirakawa and Hiroshi Ozaki}, journal={IEEE Transactions on Computers}, year={1978}, volume={C-29}, pages={681-688} }