• Corpus ID: 16696689

Aluminum Silicon Carbide (AlSiC) For Cost-Effective Thermal Management And Functional Microelectronic Packaging Design Solutions

@inproceedings{Occhionero1999AluminumSC,
  title={Aluminum Silicon Carbide (AlSiC) For Cost-Effective Thermal Management And Functional Microelectronic Packaging Design Solutions},
  author={Mark A. Occhionero and Robert A. Hay and Richard W. Adams and Kevin P. Fennessy},
  year={1999}
}

• M. Occhionero, R. Hay, +1 author K. Fennessy
• Published 1999
• Engineering

Aluminum Silicon Carbide (AlSiC) metal matrix composite (MMC) materials have a unique set of material properties that are ideally suited for electronic packaging applications requiring thermal management solutions. The AlSiC coefficient of thermal expansion (CTE) value is compatible with direct IC device attachment for the maximum thermal dissipation (AlSiC thermal conductivity 170 – 200 W/mK). The low material density of AlSiC (3 g/cm) makes it ideal for weight sensitive applications such as portable devices over traditional thermal management materials such as CuMo (10 g/cm) and CuW (16 g/cm). Structural packaging requirements are satisfied by the material strength and stiffness that are both approximately three times greater than Al-metal. Additionally, AlSiC is a hermetic material that can be used to give protection to environmentally sensitive electronic components. Also, this composite material is electronically conductive providing EMI/RFI shielding. The AlSiC material and functional electronic packaging geometries are produced using Ceramics Process Systems Corporation's QuickSetTM/QuickCastTM net-shape fabrication process. This net-shape packaging fabrication process is capable of producing complex geometrical packaging features without the need for costly machining. Additionally, functional packaging features such as feedthrus, sealrings and dielectric substrates are incorporated in AlSiC during fabrication using the CPS Concurrent IntegrationTM technique eliminating the need for the traditional assembly and brazing or soldering operations. The ideal AlSiC material properties coupled with net-shape fabrication and Concurrent IntegrationTM processes cost-effectively provide high-performance thermal management solutions in functional packaging designs. This paper will review the AlSiC material properties contrasted to traditional heat-sinking materials. AlSiC fabrication processing flow will also be reviewed and discussed. Functional packaging designs and application solutions will be illustrated through CPS AlSiC product examples.