• Corpus ID: 16696689

Aluminum Silicon Carbide (AlSiC) For Cost-Effective Thermal Management And Functional Microelectronic Packaging Design Solutions

@inproceedings{Occhionero1999AluminumSC,
  title={Aluminum Silicon Carbide (AlSiC) For Cost-Effective Thermal Management And Functional Microelectronic Packaging Design Solutions},
  author={Mark A. Occhionero and Robert A. Hay and Richard W. Adams and Kevin P. Fennessy},
  year={1999}
}
Aluminum Silicon Carbide (AlSiC) metal matrix composite (MMC) materials have a unique set of material properties that are ideally suited for electronic packaging applications requiring thermal management solutions. The AlSiC coefficient of thermal expansion (CTE) value is compatible with direct IC device attachment for the maximum thermal dissipation (AlSiC thermal conductivity 170 – 200 W/mK). The low material density of AlSiC (3 g/cm) makes it ideal for weight sensitive applications such as… 

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References

SHOWING 1-9 OF 9 REFERENCES

Aluminum Silicon Carbide (AlSiC) for Thermal Management Solutions and Functional Packaging Designs

Aluminum Silicon Carbide (AlSiC) metal matrix composite (MMC) materials have a unique set of material properties that are ideally suited for electronic packaging applications requiring thermal

Microwave multi-chip module utilizing aluminum silicon carbide with in-situ cast components and high density interconnect technology

Multi-Chip Module (MCM) designs of today place ever increasing demands upon packaging technologies. With increasing functionality and power levels being compressed into smaller packages, the

CTE Compatible Thermal Packaging Solutions - Net-Shape Fabricated AlSiC and AlN

  • Proceedings of the Third Annual Portable by Design Conference, Electronic Design, March 25-29, 1996, pp 527- 536.
  • 1996

Aluminum/Silicon Carbide (AlSiC) Metal Matrix Composites For Advanced Packaging Applications

  • Proceedings of the 1995 International Electronics Packaging Conference, IEPS, San Diego CA, September 24-27, 1995, pp 220-227.
  • 1995

Concurrent Integration™ of Al/SiC MMIC Packages

  • Proceedings of the 1995 International Symposium on Microelectronics
  • 1995

Metal Matrix Composites for Single Chip and Multichip Microprocessor Packaging

  • Proceedings of the 1995 International Electronics Packaging Conference, IEPS, San Diego CA, September 24-27, 1995.
  • 1995

Low-Cost MCM-D Cavity Substrates for Packaging High Density Si and GaAs Devices

  • Proceedings of the 10 European Microelectronics Conference, ISHM, Copenhagen, Denmark, May 14-17, 1995, pp 475-481.
  • 1995

IMAPS

  • IMAPS
  • 1997

Concurrent IntegrationTM of Al/SiC MMIC Packages

  • Proceedings of the 1995 International Symposium on Microelectronics, ISHM, Los Angeles CA, October 1995, pp 36-41.
  • 1995