Corpus ID: 16696689

Aluminum Silicon Carbide (AlSiC) For Cost-Effective Thermal Management And Functional Microelectronic Packaging Design Solutions

@inproceedings{Occhionero1999AluminumSC,
  title={Aluminum Silicon Carbide (AlSiC) For Cost-Effective Thermal Management And Functional Microelectronic Packaging Design Solutions},
  author={M. Occhionero and R. A. Hay and R. W. Adams and K. Fennessy},
  year={1999}
}
  • M. Occhionero, R. A. Hay, +1 author K. Fennessy
  • Published 1999
  • Aluminum Silicon Carbide (AlSiC) metal matrix composite (MMC) materials have a unique set of material properties that are ideally suited for electronic packaging applications requiring thermal management solutions. The AlSiC coefficient of thermal expansion (CTE) value is compatible with direct IC device attachment for the maximum thermal dissipation (AlSiC thermal conductivity 170 – 200 W/mK). The low material density of AlSiC (3 g/cm) makes it ideal for weight sensitive applications such as… CONTINUE READING

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