Aging effects on shear fatigue life and shear strength of soldered thick film joints


The effects of tin diffusion, silver and palladium dispersion, and intermetallic compound growth on the shear fatigue of solder joints between thick film mixed bonded conductor Pd-Ag and solder 62Sn-36Pb-2Ag are investigated. Microstructural analysis reveals that the intermetallic compounds (IMC's) Pd<inf>3</inf>Sn<inf>3</inf>, Pd<inf>3</inf>Sn, Pd<inf>2… (More)


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