Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy

@article{Xiao2004AgingAC,
  title={Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy},
  author={Qiang Xiao and Luu Nguyen and W T Armstrong},
  journal={2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)},
  year={2004},
  volume={2},
  pages={1325-1332 Vol.2}
}
Aging effects and creep behavior along with microstructure changes in eutectic PbSn and the lead-free solder alloy Sn3.9Ag0.6Cu were studied. The room temperature aged Sn3.9Ag0.6Cu alloy continually age-softened due to the growth of relatively large tin-rich crystals. The 180/spl deg/C aged Sn3.9Ag0.6Cu alloy initially age-softened, and the minimum flow strength was reached after one day at 180/spl deg/C. This softening correlated with the growth of relatively large tin-rich crystals and with… CONTINUE READING
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