Advancing high performance heterogeneous integration through die stacking

@article{Madden2012AdvancingHP,
  title={Advancing high performance heterogeneous integration through die stacking},
  author={Liam Madden and Ephrem Wu and Namhoon Kim and Bahareh Banijamali and Khaldoon Abugharbieh and Suresh Ramalingam and Xin Wu},
  journal={2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC)},
  year={2012},
  pages={18-24}
}
This paper describes the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration). Each device is housed in a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. Inside the package, a heterogeneous IC stack delivers up to 2.78Tb/s transceiver bandwidth. The resulting bandwidth is approximately three times that achievable in a monolithic solution. Mounted on a passive silicon interposer with through-silicon vias (TSVs), the… CONTINUE READING
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