Advances in flip chip underfill technology for lead-free component packaging

@article{Ghosh2005AdvancesIF,
  title={Advances in flip chip underfill technology for lead-free component packaging},
  author={K. Ghosh and M. McCabe and G. Tian},
  journal={Proceedings Electronic Components and Technology, 2005. ECTC '05.},
  year={2005},
  pages={1480-1485 Vol. 2}
}
  • K. Ghosh, M. McCabe, G. Tian
  • Published 2005
  • Materials Science
  • Proceedings Electronic Components and Technology, 2005. ECTC '05.
Lead containing solders have been employed as an interconnecting and surface coating material in many applications for decades. The two driving forces that affect the present and future requirements of solders for electronic and microelectronic applications are, first, the increased demands on the level of performance due to the increased density and complexity of circuitry and secondly, the concern of the toxicity and health hazard of lead. The second concern has led to government legislation… Expand
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