Advanced Simulation Techniques for Thick Photoresist Lithography

@inproceedings{Flack1997AdvancedST,
  title={Advanced Simulation Techniques for Thick Photoresist Lithography},
  author={Warren W. Flack},
  year={1997}
}
A great deal of photolithographic activity in recent years has been centered on thick photoresist films. Thin film heads (TFH), micromachining and sensor fabrication are examples of applications requiring this type of processing. The needs of the TFH industry are currently the technology driver for thick photoresist processing. Modern TFH manufacturing processes require 1 μm resolution in layers ranging in thickness from 5 to as much as 25 μm. These large aspect ratios not only make the… CONTINUE READING