Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact

@article{Luan2006AdvancedNA,
  title={Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact},
  author={Jing-en Luan and Tong Yan Tee and Eric Pek and Chwee Teck Lim and Zhaowei Zhong and Jiang Zhou},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2006},
  volume={29},
  pages={449-456}
}
Board level solder joint reliability performance during drop test is a critical concern to semiconductor and electronic product manufacturers. A new JEDEC standard for board level drop test of handheld electronic products was just released to specify the drop test procedure and conditions. However, there is no detailed information stated on dynamic responses of printed circuit board (PCB) and solder joints which are closely related to stress and strain of solder joints that affect the solder… CONTINUE READING
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