Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage

@inproceedings{Wang2002AdhesionIO,
  title={Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage},
  author={Zenglin Wang and Akihiko Furuya and Keiichirou Yasuda and Hideo Ikeda and Tomoyuki Baba and Muneaki Hagiwara and Sotaro Toki and Shoso Shingubara and Hitoshi Kubota and Tadahiro Ohmi},
  year={2002}
}
In order to enhance the adhesion strength of copper metal film to a polyimide (PI) film substrate, a method combining surface microroughness formation and imide ring cleavage was investigated. The results showed that imide rings were cleaved with a KOH treatment while carboxyl and amide groups were formed on the surface of the PI film. The surface micro-roughness did not change with the KOH treatment, and the adhesion strength of the copper metal film to the PI film was slightly improved to 30… CONTINUE READING