Active Packaging Method for Light-Emitting Diode Lamps With Photosensitive Epoxy Resins

A novel active light-emitting diode (LED) packaging method is presented. Our method utilizes the emission from the LED chip itself to package the LED with photosensitive epoxy. Such a photon-induced polymerization method, leading to the formation of specific lamp shapes and characteristics, eliminates the utilization of the mold. By controlling the… CONTINUE READING