Activation of impurity atoms in 4H-SiC wafer by atmospheric pressure thermal plasma jet irradiation


High temperature annealing of 4H-silicon carbide (SiC) wafers was performed by atmospheric-pressure thermal-plasma-jet (TPJ) irradiation. A maximum surface temperature of 1835°C within 2.4 second without sample breakage was achieved, and aluminum (Al), phosphorus (P), and arsenic (As) activations in 4H-SiC wafers were demonstrated. We have investigated the… (More)


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