Across Substrate Lateral Dimensional Repeatability Using a Highly-Anisotropic Deep Etch Process on Fused Silica Material Layers


This letter reports the research performed on the measurement of the repeatability of the resultant lateral dimensions across fused silica substrates that were etched using an inductively-coupled plasma reactive-ion etch process. We have developed and previously reported a highly-anisotropic plasma etch process with the demonstrated etch depths of over 100… (More)

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