Acoustic GHz-microscopy and its potential applications in 3D-integration technologies

  title={Acoustic GHz-microscopy and its potential applications in 3D-integration technologies},
  author={Sebastian Brand and T. Appenroth and Falk Naumann and Wolfram Steller and M. Jurgen Wolf and P. Czurratis and Frank Altmann and M. Petzold},
  journal={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)},
3D-integration is one of the most challenging approaches addressed by researchers in the field of microelectronics in the recent years. With the intension on integrating different components in three dimensions in one device performance and functionality will increase dramatically by reducing the devices footprint. A major challenge in 3D-integration concepts is the electrical interconnection of the stacked individual components. These interconnecting technologies employ micro bumping… CONTINUE READING
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  • K.U.P.M. Morse
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