Achieving high reliability low cost lead-free SAC solder joints via Mn or Ce doping

Abstract

In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, and SAC305 alloys. The Mn or Ce doped low cost SAC105 alloys achieved a higher drop test and dynamic bending test reliability than SAC105… (More)

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