Accurate characterization of board level interconnects for high performance systems

Abstract

Calibration and de-embedding techniques for time domain measurements associated with high speed off chip digital interconnects are presented. The techniques are demonstrated by measurements of skew, signal degradation, and crosstalk associated with typical interconnects in multilayered boards. 

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Cite this paper

@article{Lutz1997AccurateCO, title={Accurate characterization of board level interconnects for high performance systems}, author={R. D. Lutz and Alok Tripathi and V. Tripathi and Tamim Arabi}, journal={Electrical Performance of Electronic Packaging}, year={1997}, pages={171-174} }