Acceleration Factors for Lead-Free Solder Materials

@article{Salmela2007AccelerationFF,
  title={Acceleration Factors for Lead-Free Solder Materials},
  author={Olli Salmela},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2007},
  volume={30},
  pages={700-707}
}
  • Olli Salmela
  • Published 2007 in
    IEEE Transactions on Components and Packaging…
In this paper, the acceleration factors for lead-free solder materials are discussed. The focus is on the analytical models proposed by Norris-Landzberg, Pan, and Salmela. As most reliability prediction models are originally created for eutectic SnPb solder material, it is expected that the models must be recalibrated in order to be useful in conjunction with lead-free solder materials. Pan et al. have reparameterized the Norris-Landzberg's model for SnAgCu already earlier. However, the data… CONTINUE READING
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