APPLICABILITY OF VARIOUS Pb-FREE SOLDER JOINT ACCELERATION FACTOR MODELS

@inproceedings{Sun2006APPLICABILITYOV,
  title={APPLICABILITY OF VARIOUS Pb-FREE SOLDER JOINT ACCELERATION FACTOR MODELS},
  author={Ron Sun},
  year={2006}
}
Pb-free solder joint acceleration factor (AF) models are of interest to the electronics industry for the simple reason that, combined with test failure data, they provide a quick way to assess solder interconnect reliability. Accurate values of AFs are needed to extrapolate test results to field conditions, thus allowing for an upfront estimate of board-level reliability. In this paper, an analytical approach is first used to calculate AFs from standard temperature cycling to field conditions… CONTINUE READING