• Corpus ID: 248562675

AES Analysis of Al Bond Pads in Electrically Insulating Surroundings Utilizing Metal Grid Contacting

@inproceedings{Scheithauer2022AESAO,
  title={AES Analysis of Al Bond Pads in Electrically Insulating Surroundings Utilizing Metal Grid Contacting},
  author={Uwe Scheithauer},
  year={2022}
}
: Bond pads are the electrical interconnections of a microelectronic device to the ‘outside world’. A polyimide (PI) layer on top of a microelectronic device protects the whole device against environmental impacts. The bond pads are accessible though openings in this electrically insulating layer. The oxide layer thickness and contaminations at the Al bond pad surface influence as well the quality of the mechanical and electrical joint between bond pad and bond wire as the durability of this… 

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