A versatile, via terminated electromigration test structure for various stress modes used during fast wafer level reliability (fWLR) testing

Abstract

A multipurpose electromigration (EM) test structure designed for advanced fast wafer level reliability (WLR) tests is described in this work. It is shown that different failure location and failure modes can be detected electrically by this test structures which is beneficial for early technology development as well as productive in-line monitoring. Highly… (More)

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