A tiny plastic package of piezoresistive pressure sensors constructed by sacrifice-replacement approach

@article{Chen2008ATP,
  title={A tiny plastic package of piezoresistive pressure sensors constructed by sacrifice-replacement approach},
  author={Lung-Tai Chen and Chung-Yi Hsu and Jin-Sgeng Chang and Wen-Lo Shieh and Yue-Zhe Xie and C. H. Chu},
  journal={2008 58th Electronic Components and Technology Conference},
  year={2008},
  pages={1849-1854}
}
In this study, a tiny plastic package of piezoresistive pressure sensor was fabricated and demonstrated by employing the sacrifice-replacement approach. A JSR THB- 151N photoresist layer with a thickness of 150 mum was deposited on the silicon membrane of the pressure sensor by using a two-stage spin-coating procedure. Following a high- temperature transfer molding process, the photoresist is removed and the package is cured at 175degC for two hours. The performance of the packaged sensor is… CONTINUE READING