A study of solder joint degradation and detection using RF impedance analysis

@article{Yao2011ASO,
  title={A study of solder joint degradation and detection using RF impedance analysis},
  author={Bin Yao and Yudong Lu and Ming H Wan},
  journal={2011 International Symposium on Advanced Packaging Materials (APM)},
  year={2011},
  pages={117-121}
}
The trend of many types of electronic products is toward higher operating frequencies. At high frequencies, the signal propagation is concentrated at the surface of interconnects, which is known as the skin effect. Therefore, even a samll crack at the surface of a solder joint may directly influence the performance of high speed electronic assemblies… CONTINUE READING