A study of signal integrity issues in through-silicon-via-based 3D ICs

  title={A study of signal integrity issues in through-silicon-via-based 3D ICs},
  author={Chang Liu and Sung Kyu Lim},
  journal={2010 IEEE International Interconnect Technology Conference},
In this paper, we study the signal integrity issues of through-silicon-via (TSV)-based 3D IC layouts. Unlike the most existing work, our study reports the coupling noise among all nets and all TSVs used in a real processor design implemented in 3D. Our RTL-to-GDSII design flow consists of commercial tools, enhanced with various add-ons to handle TSV and 3D stacking. Using this tool flow, we generate GDSII-level layouts of 3D implementation and perform sign-off-level signal integrity analysis… CONTINUE READING


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