A spring-driven press device for hot embossing and thermal bonding of PMMA microfluidic chips.

@article{Chen2010ASP,
  title={A spring-driven press device for hot embossing and thermal bonding of PMMA microfluidic chips.},
  author={Zhi rong Chen and Luyan Zhang and Gang Chen},
  journal={Electrophoresis},
  year={2010},
  volume={31 15},
  pages={
          2512-9
        }
}
A novel spring-driven press device was designed and manufactured for hot embossing and thermal bonding of PMMA microfluidic chips in this work. This simple device consisted of two semi-cylinder silicone rubber press heads, three steel clamping plates, and three compression springs that were assembled together using two screw bolts and two butterfly nuts. The three springs were clamped between the upper and the middle clamping plates, whereas the two press heads were assembled between the middle… CONTINUE READING
BETA