A solder joint crack — Characteristic impedance model based on transmission line theory

@article{Liu2014ASJ,
  title={A solder joint crack — Characteristic impedance model based on transmission line theory},
  author={Ziwei Liu and Yufeng Sun},
  journal={2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS)},
  year={2014},
  pages={237-241}
}
A solder joint crack - characteristic impedance model has been established in this paper. Under high frequency operational condition, signal integrity is important to the reliability of electronic products. Solder joint crack will change the characteristic impedance of transmission channel, and then will affect the signal integrity. So establishing the model of solder joint crack and characteristic impedance could connect solder joint crack with signal distortion together. It is meaningful to… CONTINUE READING