A sensitivity study on BGA package parameters that affect pin capacitance

Abstract

To reduce the degradation of signal integrity in substrate-based, chip-on-board (COB), ball grid array (BGA) packages caused by excessive trace capacitance, a sensitivity study on package trace capacitance is presented. A test vehicle was designed and simulated for the sensitivity study using Ansoft high frequency structure simulator (HFSS) [1]. Nine… (More)

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