A self-aligned airgap interconnect scheme

@article{Chen2009ASA,
  title={A self-aligned airgap interconnect scheme},
  author={Hsien-Wei Chen and S. M. Jeng and Hao-Yi Tsai and Yu-Wen Liu and H. C. Wei and Douglas C. H. Yu and Y. C. Sun},
  journal={2009 IEEE International Interconnect Technology Conference},
  year={2009},
  pages={146-148}
}
A new air-gap interconnect scheme with no additional patterning step successfully resolves the issue of unlanded via, and provides good interconnect reliability and improved packaging margin. We demonstrate that the insertion of airgaps in a very low-k dielectric (k=2.5) reduces the RC value of a 0.07um/0.07um comb structure by ∼14%, which is equivalent to… CONTINUE READING