A reliable failure analysis methodology in analyzing the elusive gate-open failures

@article{Remo2005ARF,
  title={A reliable failure analysis methodology in analyzing the elusive gate-open failures},
  author={N. C. Remo and J.C.M. Fernandez},
  journal={Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005.},
  year={2005},
  pages={185-189}
}
Gate-open failures are typically caused by physical disconnections within the various gate contact interfaces inside the package such as gate lead post to wire bond, die bond pad to wire bond, or within the gate wire itself. Various challenges surround the analysis of gate-open failures. Among others are the electrical difficulty, the intermittent nature of… CONTINUE READING