A polyjet 3D printed alternative for package to RFIC interconnects

Abstract

Presented is a study of RFIC interconnect methodologies and a possible 3D printed alternative to traditional strategies. Using polyjet 3D printing technology, an easily reconfigurable wide bandwidth interconnect is constructed. Copper conductors are deposited on 3D printed structures, which make connection to an IC by means of conductive epoxy. Simulated… (More)

Topics

5 Figures and Tables