A novel method to predict die shift during compression molding in embedded wafer level package

@article{Khong2009ANM,
  title={A novel method to predict die shift during compression molding in embedded wafer level package},
  author={Chee Houe Khong and Aditya Kumar and Xiaowu Zhang and Gaurav Sharma and Srinivasa Rao Vempati and Kripesh Vaidyanathan and John H. Lau and Dim-Lee Kwong},
  journal={2009 59th Electronic Components and Technology Conference},
  year={2009},
  pages={535-541}
}
The increased functionality of cellular phones and handheld devices requires system level integration. Thus there is a strong demand in cell phone maker to move to embedded micro wafer level packaging (EMWLP). But the major problem encountered is die shift during compression molding. This paper presents a novel method to predict the die shift during wafer level molding process. A series of parametric studies are performed by changing the die thickness, die pitch distance and top mold chaste… CONTINUE READING

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